// // Advanced PCB – characterized with higher wiring density per unit area than conventional PCB. | XTPL
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Advanced PCB’S

Additive technology of ultraprecise dispensing for the ultimate miniaturization of conductive circuits

Advanced PCB – otherwise known as HDI (High Density Interconnector) PCB – is characterized with higher wiring density per unit area than conventional PCB. It has finer lines and spaces, smaller vias and capture pads and higher connection pad density.

Advanced PCB is used to reduce size and weight, as well as to enhance electrical performance of the device. The higher demand for PCB featured with unprecedented high-density results from the constant market pursue of miniaturization and wider arrays of the electronic components in many industry sectors. Market expectation in this regard is also to improve the effectiveness of assembly and space. In final product achieving those features can result in faster signal transmission rates and reduction of crossing delays and signal loss. Advanced PCBs are the main components of e.g. personal computers, portable computers, mobile phones, personal digital assistants, game consoles and MP3 as well as medical equipment or military communication devises.



– advanced PCB technology is more costly compared to traditional circuit boards
– PCB featured with unprecedented high-density requires technology few manufacturers can provide
– high-density circuit boards are prone to defects of conductive paths during production process (open defects) usually resulting in rejection of final product
– current available methods of repairing broken conductive paths are expensive, complex, limited & slow
– constant pursuit of miniaturization of electronic devices further magnifies these limitations


In advanced (HDI) PCB manufacturing XTPL technology can be used directly for the miniaturization of conductive circuits. Using additive method of ultraprecise dispensing, submicron conductive paths can be obtained.

Such circuits are characterized with highest degree of paths density, which is required in HDI PCB applications. In addition XTPL technology is most effective in terms of repairing defects occurring during production stage on previously obtained thin HDI PCB paths. Repairing such extremely fine electrodes is very important and cost-effective, because the cost of producing an advanced PCB is high. We can print on any type of substrate, conductive or non-conductive, e.g. glass, flexible foil (e.g. Kapton, PET, PEN, PDMS) or silicon wafers. XTPL can also print on rough surfaces as well as on 2.5D substrates. The main competitive advantage and breakthrough of the XTPL additive solution is unprecedented precision. Innovation developed by XTPL will enable the production of highly advanced circuits using cheap and scalable methods of printing.


XTPL is developing new technology that will allow for production of advanced PCBs:

– using cheap and scalable methods of printing

– ensuring unprecendented level of precision

– with additive method saving material & time

– enabling highest miniaturization by reducing width of conductive lines and distances between them

– repairing broken conductive lines in advanced circuits already in production stage

– with fast, simple & versatile technology

innovation, collaboration, and a steadfast commitment to improving the lives of patients everywhere.


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