Open defects repair

Disruptive solution for adding conductive nanostructures for various open defects repair applications with unparalleled precision, versatility and simplicity, reducing overall manufacturing cost.

PROBLEM

 

  • discontinuity of conductive paths during production, aka, open defects, usually result in rejection of product; some applications have yield as low as 50% (large displays)
  • production cost of rejected products in most cases is a between 50%-70% of the total cost
  • current available methods of repairing broken conductive paths are expensive, complex, limited & slow
  • constant pursuit of miniaturization of electronic devices further magnifies these limitations

OPEN DEFECTS IN LARGE LCDs

CURRENT SOLUTIONS

LCVD (Laser Chemical Vapour Deposition), DLD (Direct Laser Deposition), FIB (Focused Ion Beam).

XTPL SOLUTION

XTPL developed innovative printing-head and dedicated nanoinks for repairing open defects in micrometric scale (1-100 um), which together with the optical detection systems already available in the market will provide a comprehensive solution to be implemented on manufacturing lines for LCD/OLED displays, PCBs, solar cells, multichip modules, photolithographic masks & many other applications. XTPL solution allows us to repair interrupted conductive lines already in production stage using fast, simple & versatile method, leading to an overall lower production cost for our customers.

COMPARISON OF METHODS

PARAMETERFIBLCVDXTPLIMPACT ON
Minimal feature size [um]0.05 5 1flexibility of process
Deposition rate [um3/s]0.05 1060throughput
Maximal line length100 ummm rangecm rangeflexibility of process
Vacuum chamber requiredyesyesnoprocess cost and throughput
Toxic/ dangerous gases/media requirednoyesnoprocess cost and throughput
Surface damageyesyesnoflexibility of process
Leftover material yesyesnothroughput
Surface 2.5Dflat 2.5Dflexibility of process
Chemical reaction yesyesnoflexibility of process
Deposited material limited by chemical reaction limited by chemical reaction limited by viscosity flexibility of process
Price$ high$ medium$ lowprocess cost

VALUE PROPOSITION

PROOF OF CONCEPT

Before

After break reparation (detour)

Width

XTPL conductive lines with different width, printed between electrodes

Height

AFM image and profile of XTPL printed conductive line

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