Open defect repair

Additive manufacturing method for ultra-precise repair of open defects. Industrial yield improvement solutions providing structure width in the range of 1-8 um and no electric field used in the printing process

PROBLEM

 

  • discontinuity of conductive paths during production, aka, open defects, usually result in rejection of product; some applications have yield as low as 50% (large displays)
  • production cost of rejected products reaches between 50%-70% of the total manufacturing cost
  • currently available yield improvement (repair) methods are expensive, complex, limited & slow
  • constant pursuit of miniaturization of electronic devices further magnifies these limitations
  • need for additive manufacturing technology providing high precision and no electrical field damage risk

OPEN DEFECT ON A LCD TFT BACKPLANE

XTPL SOLUTION

Modern additive printing has proven to be indispensable for rapid prototyping and it is now making a strong impact on the manufacturing as well. XTPL provides disruptive technology for adding conductive structures on the individual micron scale (1-8 um) with unparalleled precision. Our innovative additive process allows for ultimate simplicity & versatility – it requires no electric field, which fully eliminates the risk of damage to the substrate and other electrically active components. XTPL solution responds to the market need of progressing miniaturization and at the same time provides a cost-effective & scalable method for open defect repair (ODR).

Structures have smooth edges which allows for deposition of continuous structures on top of them.

 

Cross section (FIB) of conductive line printed on ITO using XTPL technology.

 

Cross section (FIB) of XTPL conductive line printed on the glass.

VALUE PROPOSITION

PROOF OF CONCEPT

BEFORE XTPL REPAIR

AFTER XTPL REPAIR

GENERAL SPECIFICATION

Feature size: 1-8 um

Voltage required for printing: no

Printed material: open defect repair dedicated nanoink based on silver nanoparticles

Substrates: conductive and nonconductive, flat and 2.5D, e.g. glass, silicon wafers, kapton, PEN, PC, PDMS, PET

Resistance of detour: 0.1 Ω/um @ 5um line width

Height of detour: <250 nm

Length of detour: no limit

 

Open defect on a LCD TFT backplane (2.5D substrate) repaired by silver ink detour printed using ultra-precise deposition method developed by XTPL.

 

XTPL advanced solution works on most substrates, even ones that are flexible and non-flat.

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