
Open defect repair
Additive manufacturing method for ultra-precise repair of open defects. Industrial yield improvement solutions providing structure width in the range of 1-8 µm and no electric field used in the printing process
Additive manufacturing method for ultra-precise repair of open defects. Industrial yield improvement solutions providing structure width in the range of 1-8 µm and no electric field used in the printing process
Modern additive printing has proven to be indispensable for rapid prototyping and it is now making a strong impact on the manufacturing as well. XTPL provides disruptive technology for adding conductive structures on the individual micron scale (1-8 µm) with unparalleled precision. Our innovative additive process allows for ultimate simplicity & versatility – it requires no electric field, which fully eliminates the risk of damage to the substrate and other electrically active components. XTPL solution responds to the market need of progressing miniaturization and at the same time provides a cost-effective & scalable method for open defect repair (ODR).
Structures have smooth edges which allows for deposition of continuous structures on top of them.
BEFORE XTPL REPAIR
AFTER XTPL REPAIR
Feature size: 1-8 µm
Voltage required for printing: no
Printed material: open defect repair dedicated nanoink based on silver nanoparticles
Substrates: conductive and nonconductive, flat and 2.5D, e.g. glass, silicon wafers, kapton, PEN, PC, PDMS, PET
Resistance of detour: 0.1 Ω/µm @ 5µm line width
Height of detour: <250 nm
Length of detour: no limit
Open defect on a LCD TFT backplane (2.5D substrate) repaired by silver ink detour printed using ultra-precise deposition method developed by XTPL.
XTPL advanced solution works on most substrates, even ones that are flexible and non-flat.