Semiconductors

Innovative additive method allowing to obtain desired patterns in single step process with submicron precision

Equipment manufactures in semiconductor sector are looking for alternatives to replace photolithography with a simpler & cheaper method, yet one that allows for highest precision.

It is a subtractive process used to obtain desired geometry. It transfers shapes from a template/mask onto a substrate using light. The main disadvantage of photolithography lies in its complexity and multi-step approach. The process is also expensive and not versatile due to the necessity of masking. Photolithography requires both: an extremely clean substrate surface and ideal temperature conditions that are void of all contaminants, liquids & environmental hazards and is used only for flat surfaces in order to produce effective patterns.

PROBLEM

Taking into consideration most popular technology dedicated for the semiconductor sector:

  • photolithography
    • highly complex technique
    • expensive & not versatile
    • requires mask to obtain desired patterns
    • requires an extremely clean substrate surface and ideal temperature conditions that are void of all contaminants, liquids & environmental hazards
    • used only for flat surfaces in order to produce effective patterns

SOLUTION

XTPL developed innovative printing-head and dedicated nanoinks allowing for ultraprecise deposition and obtaining designed nanostructures for various applications in semiconductor sector. The solution ensures micrometric scale of structures (1-100 um) required by most semiconductor market players.

XTPL method allows for adding the material to obtain desired patterns in single step process with unmet submicron precision and overall simplicity. Our disruptive technology provides versatility, as it requires no special external conditions and works on most substrates, even ones that are not flat. Additive approach enabled by XTPL lacks complexity required by subtractive photolithography method, that is currently a standard used for this market. XTPL solutions will take into account all requirements of modern semiconductor industry: high throughput, miniaturization of feature size, ultra-precision and control over edge roughness, elimination of expensive masking, decrease of material consumption and material waste, reduction of process complexity, shortening of production time and decrease of overall costs. Combined with XTPL nanoinks tailored for semiconductor industry our technology can be adapted as alternative to photolithography by various subsegments of semiconductor industry.

VALUE PROPOSITION

PROOF OF CONCEPT

 

SEM image of parallel lines printed with around 3 um width and 5 um distance between the lines.

 

SEM image of parallel lines printed with designed length and position of the gap. Printed lines have 6 um width and 50 um interline distance.

 

SEM image of the printed trail with 4 um width.

 

SEM image of the pattern of XTPL logo composed from microdots deposited on the glass. Dots currently obtained on the market usually have about 50 um, the minimum is 20 um – while XTPL currently achieves dots with diameter of 1 um, and plans to go even below this limit.

The image form optical microscope of the lines printed with the speed from the range of 1 to 200 mm/s. The width of the line changes from 5 um to 1.5 um. The interline distance is 12 um.

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