Highly-concentrated silver inks and paste (up to 85 wt.%) characterized by superior stability and homogeneity. The portfolio includes CL34 Ag Nanoink, CL60 Ag Nanoink and CL85 Ag Nanopaste, suitable for a variety of deposition methods.
Read more
Highly-concentrated silver inks and paste (up to 85 wt.%) characterized by superior stability and homogeneity. The portfolio includes CL34 Ag Nanoink, CL60 Ag Nanoink and CL85 Ag Nanopaste, suitable for a variety of deposition methods.
Read more
Technical papers describing XTPL’s technology, products, solutions and selected applications
Read more
High-precision rapid prototyping printing system for microelectronics with the capability of printing ultra-fine features down to 1.5 µm
Read more
XTPL is a company developing globally innovative, additive manufacturing technology that enables ultra-precise printing of nanomaterials. Unique XTPL printing system allows for precise deposition of an in-house formulated nanoink on a variety of substrates to obtain conductive & nonconduvtive submicron structures.
Read more
Advanced, additive solution that allows for substantially reduced feature size, irrespective of the scale, without shadowing effect.
Read more
Additive manufacturing technology that allows deposition of quantum dots material with unparalleled precision, versatility and simplicity.
Read more
Structures obtained using the XTPL method retain their excellent electrical conductivity parameters throughout the deformation of the substrate, enabling mechanical flexibility of new generation displays.
Read more
XTPL disruptive deposition technology gives the ability to print single micron feature sizes with competitive XY resolution. Such precision opens up vast potential for application in manufacturing of new generation high resolution displays.
Read more
XTPL technology allows defects in conductive paths to be repaired already at the production stage with unparalleled precision, speed and no voltage applied during the printing process.
Read more
XTPL provides disruptive technology for deposition of conductive & nonconductive structures on a single micron scale (1-8 um) with unparalleled precision.
Read more
Contact our team for information, photos and press releases
Read more
We have answered some of the most frequently asked questions about our company and technology. Have a look and find out more.
Read more
The main competitive advantage of the XTPL additive solution is unprecedented precision that cannot be replicated by any other printing method in the world.
Read more
Additive manufacturing method for ultra-precise repair of open defects. Industrial yield improvement solutions providing structure width in the range of 1-8 µm and no electric field used in the printing process
Read more
Additive manufacturing technology that will allow to deposit quantum dots material with unparalleled precision, versatility and simplicity.
Read more
Breakthrough technology that will facilitate manufacturing of new generation transparent conductive films (TCFs) providing: full transparency, excellent conductance parameters, low production costs as well as sought-after technological independence from indium and flexibility.
Read more
XTPL diversifies the sources of financing using available national and international grants.
Read more
Get to know the most interesting articles about our company and technology, find out what media write about us
Read more
Find us on most importnat fairs and conferences worldwide. Let's meet there
Read more
Stay tuned with the latest information about our company, technology news, business activities, interesting events and the successes of our team.
Read more
We invite you to use our marketing materials, where you will find all information on XTPL company, technology & applications.
Read more
Innovative solution for printed biosensors that will provide highest performance and unparalleled size reduction, one that can be fabricated by inexpensive & scalable methods.
Read more
The combination of two elements – ultraprecise printing and specific inks – leads to the creation of XTPL complex anticounterfeiting system based on the fingerprint principle.
Read more
Additive technology of ultraprecise dispensing for the ultimate miniaturization of conductive circuits.
Read more
Innovative additive method allowing to obtain desired patterns in single step process with submicron precision
Read more
XTPL unique solutions are protected by international patent applications.
Read more
XTPL ranks high on the list of technology businesses in Poland with the greatest number of awards. It has been a winner and a finalist of numerous competitions in the country and abroad.
Read more
If you are looking for a job that inspires and is a source of experience, if you want to join the team that creates solutions of the future - join XTPL. We guarantee a unique work atmosphere as well as ambitious professional challenges.
Read more
XTPL team consists currently around 30 people: scientists and technologists with interdisciplinary expertise in: chemistry, physics, electronics, mechanics and numerical simulations (including 10 PhDs), as well as specialists in strategic management and commercialization, product development, implementing innovation, marketing & communication and capital market.
Read more

Investor Relations

Transparent conductive films

Breakthrough technology that will facilitate manufacturing of new generation TCFs and provide sought-after technological independence from indium & flexibility.

PROBLEM

standard TCF layers are currently based on indium-tin oxide (ITO)
TCF layers based on ITO are not flexible (a significant limitation for electronics manufacturers), they do not conduct enough electricity and have limited optical transparency
TCF layers based on ITO are expensive as indium is a rare element which supply on a global scale is mostly controlled by China (about 50% -60% of global production) and Korea (15% market share)

SOLUTION & VALUE PROPOSITION

PROOF OF CONCEPT

Image of 10 cm x 10 cm TCF sample obtained from Ag/Cu mesh with sheet resistance 22 Ohm/sq and optical transmission 93%. The width of printed lines is 5 µm and interlines distance is 500 µm. TCF was printed on the glass.

Interline distance

Applications

When you use our website, cookies or similar files will be placed on your computer, or other device connected to the internet, for statistical and functional purposes. With this technology, we will store and access information on your computer or device, primarily to facilitate your use of our website. You can modify or withdraw your consent to cookies at any time in your browser settings.

Find out more