Development of breakthrough printing technology of 3D micrometric conductive structures using an innovative printhead capable of printing on non-planar substrates and compatible ink for printed electronics applications

Implementation: October 2020 – September 2023

The aim of the project is the design and implementation of the new technology for printing of ultrafine conductive structures on 3D substrates for applications in printed electronics.

The planned effects are the innovative printing head, synthesis of high-viscosity links based on silver and copper, and control system of the printing head, based on the machine learning algorithms, allowing for printing of ultrafine conductive structures on 3D substrates for applications in printed electronics.

Project value: 11,615,569.56 PLN

EU contribution: 7,695,844.09 PLN

The project is co-financed by the European Union through the European Regional Development Fund under the Smart Growth Operational Programme (SG OP). The project is implemented under The National Centre for Research and Development competition Fast Track.