Development of additive technology for the integration of photonic integrated circuits for applications in artificial intelligence
XTPL S.A. has received a grant from the European Union for the project “Development of additive technology for the integration of photonic integrated circuits for applications in artificial intelligence.”
The project aims to develop, build, and validate a prototype of a new printing system. It is intended to be used for integrating photonic and electronic integrated circuits (PIC + EIC) as part of advanced packaging processes.
The project plans to conduct comprehensive research and development on material flow mechanisms and precise dispensing, which will enable the development and validation of a high-performance, multi-nozzle printhead. These activities will also include the integration of an intelligent automation system based on machine learning into a complete production platform.
Ultimately, the printing system will be available to customers in Poland and abroad operating in the microelectronics and artificial intelligence (AI) sectors, including data centers and telecommunications infrastructure requiring advanced optoelectronic modules.
The project will result in the creation of an innovative printing system enabling the ultra-precise fabrication of conductive connections (less than 10 µm) on complex 3D surfaces.
Project value: PLN 18,286,399.84
Contribution from European Funds: PLN 10,091,591.16