Grants

Filing a PCT Patent Application for a Method of Producing Ultra-thin Conductive Metallic Lines

CONTRACT NO: POIR.02.03.04-02-0001/16
PERIOD OF IMPLEMENTATION:
JANUARY 2016 ‒ DECEMBER 2023
VALUE: PLN 638,264
CO-FINANCING: 50%

The aim of the project is to obtain global protection of industrial property for an innovative method of producing ultra-thin conductive metallic lines. The method enables the production of TCF layers.

Project co-financed from the Smart Growth Operational Programme 2014‒2020

Priority axis 2: Support for the operating environment and potential of enterprises for R&D&I activity

Measure 2.3: Pro-innovative services for enterprises

Sub-measure 2.3.4: Protection of industrial property

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Filing a PCT Patent Application for a Method of Producing Ultra-thin Conductive Metallic Lines

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EXPERIMENT RESULT

RDL PROTOTYPING

STACKED CHIPS

PRINT ON HUMAN HAIR