• Highly-concentrated silver inks and paste (up to 85 wt.%) characterized by superior stability and homogeneity. The portfolio includes CL34 Ag Nanoink, CL60 Ag Nanoink and CL85 Ag Nanopaste, suitable for a variety of deposition methods.

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  • Highly-concentrated silver inks and paste (up to 85 wt.%) characterized by superior stability and homogeneity. The portfolio includes CL34 Ag Nanoink, CL60 Ag Nanoink and CL85 Ag Nanopaste, suitable for a variety of deposition methods.

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  • Technical papers describing XTPL’s technology, products, solutions and selected applications

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  • High-precision rapid prototyping printing system for microelectronics with the capability of printing ultra-fine features down to 1.5 µm

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  • XTPL is a company developing globally innovative, additive manufacturing technology that enables ultra-precise printing of nanomaterials. Unique XTPL printing system allows for precise deposition of an in-house formulated nanoink on a variety of substrates to obtain conductive & nonconduvtive submicron structures.

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  • Advanced, additive solution that allows for substantially reduced feature size, irrespective of the scale, without shadowing effect.

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  • Additive manufacturing technology that allows deposition of quantum dots material with unparalleled precision, versatility and simplicity.

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  • Structures obtained using the XTPL method retain their excellent electrical conductivity parameters throughout the deformation of the substrate, enabling mechanical flexibility of new generation displays.

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  • XTPL disruptive deposition technology gives the ability to print single micron feature sizes with competitive XY resolution. Such precision opens up vast potential for application in manufacturing of new generation high resolution displays.

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  • XTPL technology allows defects in conductive paths to be repaired already at the production stage with unparalleled precision, speed and no voltage applied during the printing process.

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  • XTPL provides disruptive technology for deposition of conductive & nonconductive structures on a single micron scale (1-8 um) with unparalleled precision.

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  • Contact our team for information, photos and press releases

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  • We have answered some of the most frequently asked questions about our company and technology. Have a look and find out more.

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  • The main competitive advantage of the XTPL additive solution is unprecedented precision that cannot be replicated by any other printing method in the world.

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  • Additive manufacturing method for ultra-precise repair of open defects. Industrial yield improvement solutions providing structure width in the range of 1-8 µm and no electric field used in the printing process

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  • Additive manufacturing technology that will allow to deposit quantum dots material with unparalleled precision, versatility and simplicity.

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  • Breakthrough technology that will facilitate manufacturing of new generation transparent conductive films (TCFs) providing: full transparency, excellent conductance parameters, low production costs as well as sought-after technological independence from indium and flexibility.

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  • XTPL diversifies the sources of financing using available national and international grants.

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  • Get to know the most interesting articles about our company and technology, find out what media write about us

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  • Find us on most importnat fairs and conferences worldwide. Let's meet there

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  • Stay tuned with the latest information about our company, technology news, business activities, interesting events and the successes of our team.

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  • We invite you to use our marketing materials, where you will find all information on XTPL company, technology & applications.

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  • Innovative solution for printed biosensors that will provide highest performance and unparalleled size reduction, one that can be fabricated by inexpensive & scalable methods.

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  • The combination of two elements – ultraprecise printing and specific inks – leads to the creation of XTPL complex anticounterfeiting system based on the fingerprint principle.

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  • Additive technology of ultraprecise dispensing for the ultimate miniaturization of conductive circuits.

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  • Innovative additive method allowing to obtain desired patterns in single step process with submicron precision

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  • XTPL unique solutions are protected by international patent applications.

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  • XTPL ranks high on the list of technology businesses in Poland with the greatest number of awards. It has been a winner and a finalist of numerous competitions in the country and abroad.

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  • If you are looking for a job that inspires and is a source of experience, if you want to join the team that creates solutions of the future - join XTPL. We guarantee a unique work atmosphere as well as ambitious professional challenges.

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  • XTPL team consists currently around 30 people: scientists and technologists with interdisciplinary expertise in: chemistry, physics, electronics, mechanics and numerical simulations (including 10 PhDs), as well as specialists in strategic ma­nagement and commercialization, product development, implementing innovation, marketing & communication and capital market.

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Investor Relations

Filing a PCT Patent Application for a Method of Producing Ultra-thin Conductive Metallic Lines

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Contract No: POIR.02.03.04-02-0001/16
Period of implementation:
January 2016 ‒ December 2023
Value: PLN 638,264
Co-financing: 50%

 

The aim of the project is to obtain global protection of industrial property for an innovative method of producing ultra-thin conductive metallic lines. The method enables the production of TCF layers.

 

Project co-financed from the Smart Growth Operational Programme 2014‒2020

Priority axis 2: Support for the operating environment and potential of enterprises for R&D&I activity

Measure 2.3: Pro-innovative services for enterprises

Sub-measure 2.3.4: Protection of industrial property

 

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