Filing a PCT Patent Application for a Method of Producing Ultra-thin Conductive Metallic Lines

Contract No: POIR.02.03.04-02-0001/16
Period of implementation:
January 2016 ‒ March 2019
Value: PLN 881,610
Co-financing: 50%

 

The aim of the project is to obtain global protection of industrial property for an innovative method of producing ultra-thin conductive metallic lines. The method enables the production of TCF layers.

 

Project co-financed from the Smart Growth Operational Programme 2014‒2020

Priority axis 2: Support for the operating environment and potential of enterprises for R&D&I activity

Measure 2.3: Pro-innovative services for enterprises

Sub-measure 2.3.4: Protection of industrial property

 

When you use our website, cookies or similar files will be placed on your computer, or other device connected to the internet, for statistical and functional purposes. With this technology, we will store and access information on your computer or device, primarily to facilitate your use of our website. You can modify or withdraw your consent to cookies at any time in your browser settings.

Find out more