Technology_Ultraprecise_Deposition

Ultraprecise Deposition

The main competitive advantage of the XTPL additive solution is unprecedented precision that cannot be replicated by any other printing method in the world.

 

XTPL printing head equipped with special nozzle deposits the ink on the substrate using unique ultraprecise dispensing (UPD) technology – the resolution of printed structures reaches values even below 1 um. This disruptive solution works on most substrates, even ones that are flexible and not flat.

 

UPD technology can provide straight lines, as well as patterns and microdots. What makes the XTPL solution unique is ultimate simplicity, unparalleled precision, speed & versatility. The shape of individual structures created with this method, their width, length and distance between them depend on the specific application requirements.

 

XTPL method allows to print a large variety of available materials: conductive inks, nanoparticle based suspensions, semiconductor based suspensions, insulating inks, resists, solvent based inks and biological materials. In order to achieve outstanding results XTPL creates own conductive nanoink formulas based mostly on Ag, Au or Cu nanoparticles.

PROOF OF CONCEPT

 

SEM image of parallel lines printed with around 3 um width and 5 um distance between the lines

 

SEM image of the printed trail with 4 um width

 

SEM image of  the segment of TCF printed on the glass using silver based nanoink designed & patented by XTPL. The width of the line: 6 um and interline distance: 500 um

 

SEM image of the pattern of XTPL logo composed from microdots deposited on the glass. Dots currently obtained on the market usually have about 50 um, the minimum is 20 um – while XTPL currently achieves dots with diameter of 1 um, and plans to go even below this limit

 

SEM image of printed conductive silver line on 2.5D substrate

 

SEM image showing morphology of the conductive line obtained with UPD technology

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