Technology
Ultra-Precise Dispensing*
Background
Ultra-Precise Dispensing* is the cutting-edge nanotechnology achievement, allowing for unparalleled material placement accuracy down to micrometer scales.
Benefits
We’re pioneering this revolution helping to move forward your ideas.
UPD technology at work
UPD for integration
- Specialized in advanced open defect repair for complex tech substrates
- Printing tech with 1-8 µm feature size, no specific voltage required, using proprietary nanoink with silver nanoparticles for defect repair
- Versatile substrates compatible with various materials, suitable for flat and 2.5D surfaces including glass, silicon, kapton, PEN, PC, PDMS, PET
- Precise resistance control at 0.1 Ω/µm, with 5 µm line width and sub-250 nm height, allowing for extensive design flexibility
- Pioneering system-on-chip development with conductive/insulating microvias for High-Density Interconnect (HDI)
- Ultra-high resolution features below 1 µm using photonic sintering for optimal electrical resistances
3D interconnections within the circuit
Stacked chip technology
- High density interconnections on stacked chips
- Resolution <10 μm/10 μm L/S
- No satellite droplets and line width homogeneity to prevent electrical shorts
- Application in industries like semiconductors, microelectronics, FPD, MEMS and flexible hybrid electronics
STACKED CHIPS
Powering MicroLED Integration
- Facilitates control, driving and power dispensing of microLED displays
- Expands applications in AR/VR, smartwatches and automotive displays
MICROLED INTEGRATION
Industries we drive forward
Contact us
- We will introduce our product
- We will explain how you can utilize it in your work
- We will address your questions and provide guidance
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