Consumer electronics

Challenges

• Constant pursuit of miniaturization of electronic devices
• The production cost budget is substantially impacted by expenses associated with manufacturing rejected products
• Currently available yield improvement (repair) methods are expensive, complex, limited & slow
• Discontinuity of conductive paths during production (open defects) and lack of repairing methods usually result in rejection of product
• Need for additive manufacturing technology providing high precision and no electrical field damage risk

Benefits

Modern additive printing has proven to be indispensable for rapid prototyping and it is now making a strong impact on the manufacturing.

• Reducing defects by repairing open defects that are not repairable by conventional methods
• Improving production efficiency by maximizing the number of non-defective parts through the implementation of XTPL technology is an effective way to reduce production costs
• The ability to produce at higher resolutions – co-creating the technologies of tomorrow and supporting the drive toward miniaturization
• Enhanced product quality achieved through robust adhesion to the substrate, ensuring stable and short-circuit-free interconnections
• Prioritizing sustainability as a core value in the semiconductor industry, utilizing XTPL’s additive technology and non-toxic materials
• XTPL’s electromagnetically compatible (EMC) technology ensures safe dispensing without electricity, eliminating the risk of damage to substrates and electronic components

Challenges

• The stacking of components in 3D ICs creates significant challenges in managing heat, which can affect performance and reliability
• The complex process of manufacturing 3D ICs leads to higher costs and lower production yields, impacting cost-efficiency which is crucial in consumer electronics
• 3D ICs present more complex design and testing issues compared to traditional 2D ICs, increasing the time and resources needed for development
• Ensuring the quality and performance of inter-layer connections is critical, as failures can compromise the entire IC
• While 3D ICs can potentially lower power consumption through shorter interconnects, the increased power density in the stacked layers poses challenges for energy efficiency and heat management

Benefits

Three-dimensional integrated circuit (3D IC) packaging offers the potential for improved performance, reduced form factor, and enhanced power efficiency in consumer electronics.

• XTPL’s ability to create highly conductive, fine lines can enhance heat dissipation, mitigating thermal challenges in 3D IC stacking
• XTPL’s precise material dispensing leads to higher yields and less complexity in 3D IC fabrication
• The technology’s nanoscale precision enables intricate designs, easing the complexities in designing and testing 3D ICs
• XTPL’s ultra-fine, conductive lines are key to developing more efficient and reliable interconnects in 3D ICs
• Precise interconnects and layouts from XTPL can help in better power distribution, reducing power consumption and managing power density in 3D ICs

Challenges

• Colour-filter layers based on quantum dots are currently produced using material- & time-consuming subtractive methods
• Available technologies for quantum dots dispensing are expensive, complex, limited & slow
• Constant pursuit of miniaturization of pixels and increased luminous efficiency of display devices further magnifies these limitations

Benefits

Dispensed microdots currently obtained on the market usually have about 50 µm, the minimum is 20 µm. Our additive manufacturing technology will allow to dispense microdots with diameter of 1 µm.

• Saving material and time
• Reducing overall manufacturing cost
• Production of advanced devices with cheap and scalable methods