Ultra-Precise Dispensing^* System

Precision and accuracy

Ultra Precise Dispensing* System guarantees unparalleled precision and accuracy in dispensing nanomaterials, leading to the creation of highly precise conductive and nonconductive structures

Material versatility and compatibility

The system accommodates a wide range of nanomaterials, ensuring compatibility with diverse conductive and nonconductive substances for the production of specialized structures and coatings

Customization and flexibility

Tailored dispensing parameters and configurations offer adaptability, enabling manufacturers to meet specific production requirements and diverse applications

High throughput

Integrated seamlessly into production lines, the dispensing system enhances throughput, enabling faster manufacturing without sacrificing precision

Scalability

Serving as a one-stop solution, the dispensing system is scalable for diverse production scales, ranging from small batches to large-scale manufacturing

Reduced production downtime

The reliable and robust Ultra Precise Dispensing* System minimizes downtime, improving overall production efficiency and output

Expert Engineering Support

Top-notch engineering services provide manufacturers with expert guidance, support, and troubleshooting during integration, optimizing overall system performance

The future of miniaturization

• Facilitates seamless integration
• Provides flexibility and miniaturization for FHE, IC packaging, IoT systems, antennas, biosensors and more

Advanced microbumps

• Controlled, precise dispensing of microbumps below 10 μm
• Boosts performance in versatile scaling down of the IC packaging, system-on-the-chip designs

Innovative material filling

• Enables reliable connections, enhances thermal management and miniaturization
• Enhances functionality and performance for advanced packaging, 
flip-chip and TSV
• Variety of materials: conductive, dielectric, photoresist, QDots

Enhancing displays

• Facilitates control, driving and power dispensing of microLED displays
• Expands applications in AR/VR, smartwatches and automotive displays

Advancing micro interconnections

• Open defect repair on complex technological substrates and system-on-the-chips
• Conductive and insulating microvias in High Density Interconnect (HDI)
• Ultra-high resolution features below 1 µm
• Photonic sintering enables electrical resistances <1 Ω/µm
• Variety of materials: conductive, dielectric, photoresist, QDots and more

Next-gen circuit refinement

• Fixing design flaws or intentional changes by local dispensing on 2D/3D connection
• Via filling directly on the circuit
• Versatile material dispensing on complex technological substrates