
Industrial yield improvement
XTPL technology allows defects in conductive paths to be repaired already at the production stage with unparalleled precision, speed and no voltage applied during the printing process
XTPL technology allows defects in conductive paths to be repaired already at the production stage with unparalleled precision, speed and no voltage applied during the printing process
One of the challenges faced by the modern FPD manufacturing lies in the fact that fine conductive structures with a width on a single micron scale are prone to damage.
This is a major factor contributing to the decrease of the production yield. XTPL has developed an advanced additive method for open defect repair (ODR) that responds to manufacturers requirements.
Cross section (FIB) of conductive line printed on ITO using XTPL technology.
Cross section (FIB) of XTPL conductive line printed on the glass.
Structures have smooth edges which allows for deposition of continuous structures on top of them.