Industrial yield improvement

XTPL technology allows defects in conductive paths to be repaired already at the production stage with unparalleled precision, speed and no voltage applied during the printing process

One of the challenges faced by the modern FPD manufacturing lies in the fact that fine conductive structures with a width on a single micron scale are prone to damage.

This is a major factor contributing to the decrease of the production yield. XTPL has developed an advanced additive method for open defect repair (ODR) that responds to manufacturers requirements.



After XTPL repair




  • no electric field required for printing – no risk of damage to the substrate and other electrically active components
  • non-electrostatic alternative to the EHD technology
  • repairing broken conductive lines at the production stage
  • reduced takt time (TT)
  • high spatial density of the printed features
  • high adhesion to the substrate
  • no toxic substances
  • lower production cost for the manufacturers
  • works on various substrates
  • good coverage of steps on patterned TFT-array substrates


Cross section (FIB) of conductive line printed on ITO using XTPL technology.


Cross section (FIB) of XTPL conductive line printed on the glass.

Structures have smooth edges which allows for deposition of continuous structures on top of them.

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