High-resolution 3D-printed conductive features in single micron scale
WEBINAR | Thursday 17 December 2020
WEBINAR ON-DEMAND
ABSTRACT
We demonstrate a novel ultra-precise deposition (UPD) technology for rapid prototyping of microelectronic devices.
Join webinar for a demonstration of a novel ultra-precise deposition (UPD) technology for rapid prototyping of microelectronic devices. UPD allows maskless deposition of high-viscosity metallic and non-metallic inks with the printed feature size as small as 1 µm. XTPL technology answers some of the key challenges in the fabrication of high-density microelectronics. It is possible to print on complex 3D substrates and obtain structures with arbitrary shapes, including lines, dots, crosses, and meshes
- What technologies are available for printing of micrometer-size structures
- Key features of a novel printing technology developed by XTPL
- Benefits of using high-viscosity inks when printing on complex topographies
- How to print planar chip interconnections
- Examples of industrial use of the direct deposition technology
HIGH STEP COVERAGE
Ultra-high resolution of printed features
PRESENTER
Dr Filip Granek
CEO at XTPL S.A. in Poland
Co-founder and co-inventor of XTPL technology. Received his masters in electrical engineering from Wroclaw University of Technology in Wroclaw, Poland and his PhD degree in Material science from Albert Ludwigs University in Freiburg, Germany. Performed research at the international hi-tech research facilities and businesses such as Fraunhofer ISE (Germany), ECN (the Netherlands), ANU (Australia), Kingstone Semiconductor Company Ltd. (China). He authored 70 academic publications (over 1300 citations) and is the inventor and co-inventor of 30 international patent applications and patents.
COMPANY DESCRIPTION
XTPL operates in the nanotechnology market segment. The company is developing and commercializing its globally innovative platform technology of ultra-precise printing of nanomaterials, protected by international patent applications.
The XTPL method is a breakthrough. This is because of a unique combination of several features: it is an additive method, which ensures significant time and material savings and allows the advantages of print – such as scalability, cost effectiveness, simplicity and speed – to be used in the production of advanced devices thanks to unprecedented precision (structures width from 1.5 µm) and without a need to use electric field. Due to its platform character, this solution will find application in the broadly understood printed electronics industry.
Registration for the XTPL webinar
Thursday 17 December 2020
Recorded webinar available at:
