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The Mastery of UPD Technology in Nanomaterial Dispensing for Advanced Manufacturing

XTPL S.A. asserts its industry leadership through the deployment of the revolutionary Ultra Precise Dispensing (UPD) technology. This state-of-the-art system, synonymous with precision and innovation, seamlessly integrates into both existing and prospective production lines. It offers unparalleled capabilities in the precise dispensing of nanomaterials with extraordinary precision and accuracy, thereby establishing a new benchmark in advanced manufacturing processes.

Unveiling UPD Technology

The UPD system, exemplifying ultra-high resolution printing, redefines precision in nanomaterial dispensing. Its key technological capabilities encompass:

  • 2D, 3D Conductive Micro Interconnections:

– Proficient in open defect repair methodologies applied to intricate technological substrates.

In the realm of cutting-edge printing technologies, our specifications set new standards. The feature size for our avant-garde printing process ranges precisely from 1 to 8 µm, eliminating the need for any specific voltage during the printing operation. At the heart of this innovation lies our proprietary nanoink, meticulously formulated for open defect repair, harnessing the power of silver nanoparticles.

Versatility defines our substrates, accommodating both conductive and nonconductive materials across flat and 2.5D configurations. Imprint your designs on a diverse array of surfaces, including glass, silicon wafers, kapton, PEN, PC, PDMS, and PET.

Delving into the intricacies, the resistance of our detour is finely tuned to 0.1 Ω/µm, ensuring precision with a 5 µm line width. The detour’s stature is limited to a mere <250 nm in height, yet its length knows no bounds, offering limitless possibilities for your creative endeavors. Welcome to the forefront of technological prowess, where boundaries are pushed and possibilities are endless.

– Trailblazing the development of system-on-the-chips with conductive and insulating microvias in High-Density Interconnect (HDI).

– Accomplishing ultra-high resolution features below 1 µm through the utilization of photonic sintering, ensuring optimal electrical resistances.

  • Ultra-Precise Circuit Editing:

– Mitigating design flaws or intentional modifications via targeted dispensing directly on 2D/3D connections within the circuit.

– Showcasing flexibility in dispensing materials on complex technological substrates.

 

Applications Across Industries

  • Customer Electronics

The UPD technology in advanced PCBs, also known as HDI (High Density Interconnector) PCBs, stands out for its superior wiring density per unit area compared to conventional PCBs. It features finer lines and spaces, smaller vias and capture pads, and a higher connection pad density. However, the adoption of advanced PCB technology comes with challenges. Firstly, it is more costly compared to traditional circuit boards. Additionally, the production of high-density circuits requires specialized technology that only a limited number of manufacturers can provide. These high-density circuit boards are susceptible to defects in conductive paths during the production process, particularly open defects, leading to the rejection of the final product. The existing methods for repairing broken conductive paths are expensive, complex, limited, and slow. The constant drive for miniaturization in electronic devices exacerbates these limitations.

To address these challenges, the solution focuses on circuits with the highest path density, crucial for HDI PCB applications. XTPL technology excels in effectively repairing defects occurring during the production stage on previously obtained thin HDI PCB paths. This capability is essential and cost-effective given the high production costs associated with advanced PCBs. Our technology is versatile, capable of printing on various substrates, including conductive or non-conductive materials such as glass, flexible foils (e.g., Kapton, PET, PEN, PDMS), or silicon wafers. XTPL can even print on rough surfaces and 2.5D substrates. The key competitive advantage and breakthrough of the XTPL additive solution lie in its unprecedented precision. The innovation developed by XTPL enables the production of highly advanced circuits using cost-effective and scalable printing methods.

  • MEMS (Micro-Electro-Mechanical Systems)

In MEMS applications, UPD technology assumes a pivotal role in the fabrication of microstructures with ultra-high resolution. Its precision in dispensing enables the creation of intricate MEMS devices, propelling advancements in sensors, actuators, and other microscale components essential for a diverse range of industries.

  • Healthtech

The UPD system initiates a paradigm shift in health technology by facilitating the fabrication of biosensors with unparalleled precision. The ultra-precise dispensing technology ensures the accurate deposition of biomaterials, thereby contributing significantly to the advancement of sophisticated diagnostic tools and implantable medical devices.

 

Unmatched Benefits of UPD Technology

  • Precision and Accuracy

The UPD system ensures unrivaled precision and accuracy in the dispensation of nanomaterials, culminating in the fabrication of highly precise conductive and nonconductive structures pivotal for advanced electronic components.

Exceptional precision in the printing process enables consistent management of deposition at a femtoliter scale. This technology allows for the printing of conductive micro-bumps utilizing XTPL Ag Nano-paste, as well as the generation of microdots using various materials such as photoresists, Quantum Dots inks, and Polyimide inks.

  • Versatility in Material Compatibility

Adapting to an extensive array of nanomaterials, UPD ensures compatibility with various conductive and nonconductive substances. This capability provides manufacturers with the flexibility to employ diverse materials in crafting specialized structures and coatings.

  • Customization and Flexibility

Tailored dispensing parameters and configurations offer flexibility, empowering manufacturers to customize the system to meet specific production requirements and diverse applications. This adaptability ensures optimal performance across varied manufacturing scenarios.

The standard configuration of the XTPL UPD System® features a working area of 80 x 80 mm, while the advanced configuration extends the working area to 200 x 200 mm. We are presently in the process of developing a solution with a working area of 300 x 300 mm, expected to be released shortly.

For larger stage sizes beyond our standard configurations, XTPL typically suggests utilizing substrate motion instead of the standard kinematics to enhance motion performance. Nevertheless, in response to specific customer needs, we are open to considering customized solutions.

  • High Throughput

Seamless integration into production lines enhances throughput, enabling increased manufacturing speed without compromising precision—a critical advantage in the dynamic realm of advanced manufacturing. The technology provides an appealing combination of high throughput and a resolution below 10 μm in diameter. It is characterized by excellent repeatability, stability, and a notable aspect ratio, specifically 8 μm in diameter and 800 nm in height.

  • Scalability

Positioned as a comprehensive solution, the UPD system is inherently scalable to accommodate a spectrum of production scales, ranging from small batches to large-scale manufacturing. This scalability ensures adaptability to the dynamic and evolving needs of manufacturers.

  • Reduced Production Downtime

The UPD system’s reliable and robust nature minimizes downtime, thereby contributing to heightened overall production efficiency and output. This reliability stands as a testament to its performance in demanding manufacturing environments.

  • Expert Engineering Support

The inclusion of top-notch engineering services guarantees that manufacturers receive expert guidance, support, and troubleshooting throughout the integration process. This commitment optimizes overall system performance and ensures a seamless transition to UPD technology.

 

Conclusion

UPD technology emerges as a transformative force in the domain of precision printing, showcasing its capabilities and advantages across diverse industries. With its ultra-precise dispensing capabilities, UPD not only aligns with current manufacturing standards but also charts a course for the future of nanomaterial dispensing, where precision and innovation converge. As industries undergo continual evolution, UPD technology stands at the vanguard, reshaping the landscape of advanced manufacturing with its unparalleled precision and versatility.

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