Rapid prototyping for microelectronics applications
2 WEBINAR TIMES: TUE February 16th, 2021, 10:00 am (UTC -8) WED February 17th, 2021, 11:00 am (UTC +1)
WEBINAR ON-DEMAND
ABSTRACT
Rapid prototyping solutions can help in shortening development time and decreasing expenses.
For electronic applications, maskless additive manufacturing solutions increased their possibilities in recent years, matching most of the requirements. During the webinar we would like to introduce a new approach to bring rapid prototyping possibilities to the feature sizes and applications previously unavailable to other printing techniques. Join our webinar to learn more about how you can decrease expenses, keep IP in house and shorten R&D time of microelectronic products.
-
3D interconnections for advanced IC packaging
-
Microdots deposition for flip chip conductive adhesive
-
Yield management for OLED and microLED Flat Panel Displays, displays prototyping
-
MEMS prototyping
-
High-precision local repairs
-
Micro via filling – TSV RDL application
-
High-frequency transistors
-
Microwave and RF components
EXAMPLES OF APPLICATIONS
Silver lines printed on the PEN foil
High-resolution conductive connections printed over the step
PRESENTER
Dr Filip Granek
CEO at XTPL S.A. in Poland
Co-founder and co-inventor of XTPL technology. Received his masters in electrical engineering from Wroclaw University of Technology in Wroclaw, Poland and his PhD degree in Material science from Albert Ludwigs University in Freiburg, Germany. Performed research at the international hi-tech research facilities and businesses such as Fraunhofer ISE (Germany), ECN (the Netherlands), ANU (Australia), Kingstone Semiconductor Company Ltd. (China). He authored 70 academic publications (over 1300 citations) and is the inventor and co-inventor of 30 international patent applications and patents.
COMPANY DESCRIPTION
XTPL operates in the nanotechnology market segment. The company is developing and commercializing its globally innovative platform technology of ultra-precise printing of nanomaterials, protected by international patent applications.
The XTPL method is a breakthrough. This is because of a unique combination of several features: it is an additive method, which ensures significant time and material savings and allows the advantages of print – such as scalability, cost effectiveness, simplicity and speed – to be used in the production of advanced devices thanks to unprecedented precision (structures width from 1.5 µm) and without a need to use electric field. Due to its platform character, this solution will find application in the broadly understood printed electronics industry.
Registration for the XTPL webinar
Tuesday 16 February 2021
Recorded webinar available at:
