Ultra-precise printing of micrometre size interconnections
2 WEBINAR TIMES: WED June 23rd, 2021, 10:00 am (UTC -7) THUR June 24th, 2021, 11:00 am (UTC +2)WEBINAR ON-DEMAND
In recent years the interest in introducing printing technologies to the microelectronics industry is growing rapidly. The main factors include freedom of operation, low material waste and decrease of fabrication steps.
During the webinar, we would like to introduce XTPL’s approach to bringing printing technology to the feature sizes and applications which are still not covered by other additive methods. Join our webinar to learn more about how XTPL Ultra-Precise Technology can be applied to the microelectronics, flat panel display and advanced IC packaging industries, starting today with increasing your R&D capabilities.
- 3D interconnections for advanced IC packaging
- Microdots deposition for flip-chip conductive adhesion
- Flat Panel Displays (yield management for OLED and microLED, displays prototyping)
- MEMS prototyping
- Local repairs (high precision)
- Via filling – TSV RDL application
- Microwave and RF components
High-resolution conductive connections printes over the step
1 µm wide conductive lines printed on the electrical layer of high-resolution OLED displays.
BUSINESS DEVELOPMENT MANAGER
Responsible for commercialization of XTPL products and technology to the R&D and manufacturing sectors. He received his Master of Science degree in the field of Electronics Photonics and Microsystems at Wroclaw University of Science and Technology. After graduation he continued his research activities in the projects related to fabrication of optoelectronic and other semiconductor devices, including Quantum Cascade Lasers. For over 3 years Łukasz has been working at the Business Development department at XTPL, managing commercialization activities and introducing Ultra-Precise Deposition technology to industry and R&D customers.
XTPL operates in the nanotechnology market segment. The company is developing and commercializing its globally innovative platform technology of ultra-precise printing of nanomaterials, protected by international patent applications.
The XTPL method is a breakthrough. This is because of a unique combination of several features: it is an additive method, which ensures significant time and material savings and allows the advantages of print – such as scalability, cost effectiveness, simplicity and speed – to be used in the production of advanced devices thanks to unprecedented precision (structures width from 1 µm) and without a need to use electric field. Due to its platform character, this solution will find application in the broadly understood printed electronics industry.
Registration for the XTPL webinar
Wednesday June 23rd, 2021
Recorded webinar available at: